Experts from the Fujitsu developed a new effective method of cooling the most "hot" components in the smartphone. This is a very compact and thin heat pipe system - cooling module thickness of only 1 mm.
Within a closed system is a special liquid that turns to steam during heating, cooling down after turning into condensate and continues to circulate on, "in a circle". Such a system, for example, is used for cooling high-end graphics cards.
This heat pipe consists of a thin copper sheet with an extremely small thickness - 0.1 mm. Fujitsu says that such a system is much more efficient cooling of traditional systems used in smartphones. It will be able to keep the device temperature constant by increasing the current in power components 5 times.But the serial installation of a new cooling system is planned only for 2017.
